针对新一代通信、雷达、卫星等领域对射频开关矩阵小型化、通用化的应用需求，设计了一种射频开关矩阵，采用基于高温共烧陶瓷（HTCC）工艺的系统级封装（SiP）技术，在仅 18 mm×10. 5 mm×3 mm 尺寸下实现了 3×2 射频开关矩阵的高度集成，具有高隔离、低插损、体积小、成本低、可扩展性与复用性强等特点。经仿真计算与实物测试验证，该射频开关矩阵性能满足工程多样化应用场景的需求，具有较高的工程应用价值。

This study designed an radiofrequency （RF） switch matrix using system-in-package technology based on high-temperature co-fired ceramic processes to address the demand for miniaturization and generalization of RF switch matrices in next-generation communication， radars， satellites， and other related fields. The proposed 3×2 RF switch matrix achieves a high level of integration within compact dimensions of only 18 mm × 10. 5 mm × 3 mm. It exhibits high isolation， low insertion loss， low form factor， low cost， strong scalability， and reusability. Simulation analysis and physical prototype tests demonstrate that the performance of the developed RF switch matrix satisfies diverse requirements for engineering applications， indicating its high potential for practical deployment.

TN61