The process design technique of a Kuband tiletype T/R module is described in this paper. The whole module adopts the LTCC highfrequency board, lowfrequency power PCB board and control PCB board, and uses the threedimensional assembly method to achieve product miniaturization. The product adopts goldtin soldered SMP joints to achieve hermetic welding. At the same time, four kinds of welding materials are used to achieve the temperature gradient welding of the products. And the process identification of key processes is carried out to ensure the longterm reliability of the product.
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廖雯,毛繁,但雪梅,何玮洁,刘明强.一种瓦片式T/R的关键工艺分析[J].压电与声光,2018,40(3):323-325. LIAO Wen, MAO Fan, DAN Xuemei, HE Weijie, LIU Mingqiang. Key Process Analysis of a Tiletype T/R Module[J]. PIEZOELECTRICS AND ACOUSTOOPTICS