The development of SAW device miniaturization was introduced with the SAW chip scaled and wafer leveled packages of EPCOS as examples.The construction features of SAW device chip scaled package in various development stages were especially presented in this paper.Since the flip chip technique,the film lamination technique and the wafer bonding technique was used,the SAW device size was reduced to the extreme.The development trend of SAW modularization package was also presented in this paper.