NiPdAu PCB is proposed in order to improving reliability and economy of bonding of MEMS packaging. Because Pd is joined in protecting involucra,bonding technology parameter must change.In this paper,Taguchi method of DOE is used and optimized bonding technology parameter of new type NiPdAu involucra has been discovered.According to optimize results,mending bonding technology parameter and Ni Pd Au PCB is triumphantly used into MEMS packaging technology,not only increasing reliability of products,but also reducing cost of raw and processed materials and obtaining well economy benefit.