The megasonic cleaning technique using the alkaline hydrogen peroxide solution with light concentration to clean the piezoelectric wafers such as LiTaO3, LiNbO3 and quartz has been presented in this paper. The particles with size of less than 0.2 μm adhered to the surface of the wafer can be removed effectively by using this technique without damaging the characteristics of the piezoelectric wafers. The surface cleanliness of the wafer can satisfy the mass production requirements for high frequency SAW devices with submicron line width while the consumption quantities of chemical products and deionized water can be cut down as well as the circumstance pollution risk can be reduced.