Ultrasonic testing with power pillar insulator has played an important role in preventing and detecting the crack and preventing fracture. Ultrasonic transducer is the basis of the test components, and the piezoelectric ceramic chip is the core components, its performance directly affect the test results. In order to avoid the shortage in traditional analytic method and the finite element analysis (FEA) in the analysis of piezoelectric ceramic chip, the software ANSYS analysis was used in the piezoelectric ceramic chip. Based on the electric structure coupling model, the static, modal, harmonic response and transient state simulation was used in the rectangular piezoelectric ceramic chip of ultrasonic transducer. The natural frequencies, vibration mode, frequency displacement response of the wafer were analyzed through the ANSYS based finite element analysis including the modal and harmonic response analysis of the piezoelectric ceramic chip. The research results would help to improve the performance of ultrasonic radiation power and ultrasonic transducer with certain theoretical guidance and engineering application value.