耦合型超薄悬臂梁阵列释放工艺分析
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国家自然科学基金青年科学基金资助项目(61104226);国家重大科学研究计划基金资助项目(2010CB934700)

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Analysis on the Release Process of Coupled Ultra thin Cantilever Arrays
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    摘要:

    针对耦合型超薄悬臂梁阵列释放过程中发生的粘附现象,采用背面湿法腐蚀的释放工艺,研究了液体表面张力对悬臂梁释放时的影响。通过改变悬臂梁释放时的液体环境和清洗方法,降低液体表面张力,避免悬臂梁的粘连,成功制备出长为220 μm,宽为10 μm,厚为220 nm的超薄悬臂梁,成品率可达100%。

    Abstract:

    Aimed at the adhesion phenomenon of coupled ultra thin cantilever arrays in release process,the effect of surface tension of the liquid on the cantilever was researched,using release process by backside wet etching.By changing the liquid environment when cantilevers were released and the cleaning method,the surface tension of the liquid was reduce to avoid the adhesion of the beams.Ultra thin cantilevers with length of 220 μm,width of 10 μm and thickness of 220 nm were fabricated successfully.The yield of these cantilever arrays was up to 100%.

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魏晓玮,苗斌,李加东,吴东岷.耦合型超薄悬臂梁阵列释放工艺分析[J].压电与声光,2015,37(1):43-45. WEI Xiaowei, MIAO Bin, LI Jiadong, WU Dongmin. Analysis on the Release Process of Coupled Ultra thin Cantilever Arrays[J]. PIEZOELECTRICS AND ACOUSTOOPTICS

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  • 在线发布日期: 2015-01-22
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