声表面波器件小型化工艺中芯片的测试与改进
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Testing and Improvement for Chip on SAW Device Miniaturuzation Technology
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    摘要:

    晶圆芯片测试,依靠探针触点与芯片电极间的机械接触,实现机 电连接和信号转换,从而完成对器件的电参数测试。该文通过设计和加工微探卡的方式,针对探针与芯片接触触点少导致接地信号采集不完整,影响芯片测试时带内波动、芯片测试与成品测试结果差异大的难题,提出了低损耗声表面波(SAW)滤波器设计结构中模拟焊点引线的方式,通过采集芯片电信号,在频域内做测试,满足晶圆级封装(WLP)、芯片级封装(CSP)等封装工艺的检测要求,鉴别出在芯片粘在外壳前合格的芯片,同时监测参数的分布状态来保持前道工艺的质量水平,反馈芯片的合格率与不良率。

    Abstract:

    The SAW chip test can be carried out by the mechanical contact between the probe contact and the chip electrode to realize the connection of the mechanism to electricity and the signal conversion,thus the electrical parameters of SAW device can be carried out.By Designing and processing the minitype probe card by simulating spot welding′ s method for the low wastage of the SAW′ design for the present probe with the less tip,the measured difference between the chip measuing and the fingished product measuring for grasping the ground signal has been resoled, and the demand for the technology of WLP and CSP package can be satisfied. Marking the bad chip with electrical signal before the chip in the wafer was packed and controlled the quality' level to feed back the eligible percent, inspecting the parameter's distributing state.

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董姝,伍平,米佳,赵学梅,张静雯.声表面波器件小型化工艺中芯片的测试与改进[J].压电与声光,2015,37(1):147-148. DONG Shu, WU Ping, MI Jia, ZHAO Xuemei, ZHANG Jingwen. Testing and Improvement for Chip on SAW Device Miniaturuzation Technology[J]. PIEZOELECTRICS AND ACOUSTOOPTICS

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  • 在线发布日期: 2015-01-22
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