The SAW chip test can be carried out by the mechanical contact between the probe contact and the chip electrode to realize the connection of the mechanism to electricity and the signal conversion,thus the electrical parameters of SAW device can be carried out.By Designing and processing the minitype probe card by simulating spot welding′ s method for the low wastage of the SAW′ design for the present probe with the less tip,the measured difference between the chip measuing and the fingished product measuring for grasping the ground signal has been resoled, and the demand for the technology of WLP and CSP package can be satisfied. Marking the bad chip with electrical signal before the chip in the wafer was packed and controlled the quality' level to feed back the eligible percent, inspecting the parameter's distributing state.
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董姝,伍平,米佳,赵学梅,张静雯.声表面波器件小型化工艺中芯片的测试与改进[J].压电与声光,2015,37(1):147-148. DONG Shu, WU Ping, MI Jia, ZHAO Xuemei, ZHANG Jingwen. Testing and Improvement for Chip on SAW Device Miniaturuzation Technology[J]. PIEZOELECTRICS AND ACOUSTOOPTICS