Abstract:This paper gives a method for manufacturing silicon micromechanical gyroscopes. The method can be applied to a variety of MEMS (MicroElectroMechanical System) devices, including accelerometers, shear stress sensor, MEMS optical switch and so on. Using this method, silicon MEMS gyroscope is processed, and its performance testing results are presented. Meanwhile, the impacts of the process on device performance by using the method for manufacturing silicon micromechanical gyroscopes have also been analyzed. It focuses on siliconglass anodic bonding, thinning process and deep etching process, which covers vertical sidewalls, degree sidewall impurities and other effects on the device performance.