This paper concentrated on the piezoelectric laminates whose thickness of the bonding layer could not be ignored. The distribution of shear stress of the bonding layer between the piezoelectric layer and substrate was studied based on the normal stress of the piezoelectric laminates. Then, the model of distribution of stress and strain of the interface between different layers was developed, and the distribution of stress and strain between the piezoelectric layer and the substrate was obtained. Based on the model, the influence of the geometric parameters of piezoelectric laminates and the physical parameters of material on the distribution of stress and strain was also studied. At last, combining with the deformation model of piezoelectric laminates under electrical load, the model of distribution of stress and strain was validated by comparing the calculated deformation with the experiment.