The failure of electronic products is closely related with the external stress. The reliability of the products can be increased through improving the design and process as well as reducing the external strees effect on the weak parts. Some measres of the flexible connection of slivering copper wire, chamber angle treatment of mounting hole and adding adhesive dispensing etc. are presented in this paper by analyzing the case of welding spot cracking of a certain type of microwave module during the vibration experiment. These measures are verified by the random vibration tests under the conditions of vibration magnitude of 12g, 15g, 22.3g (g=10 m/s2) , the sineswept vibration and the temperature shock test. The results show that the microwave modules can meet the application requirements in the whole systems.