The current status and problems of the microcircuit packaging technology (MPT) for beam encapsulation diode (BED) are introduced in this paper. The experiment and simulation on the ultrasonic hot embossing flip chip (FC) and the viscose interconnection are carried out, the influences of different electrodes and the substrate coating on the assembly scheme are analyzed and validated through the stress experiment. The effective norm assembly scheme and reliable and feasible engineering specification conclusion are put forward. The problems of chaotic beam diode assembly scheme, poor batch consistency, difficult debugging and high cost have been solved.
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李伟, 吕翼, 陶毅, 杨桃均, 张静雯, 王岚.梁式封装二极管的微组装技术[J].压电与声光,2017,39(3):448-451. LI Wei, LYU Yi, TAO Yi, YANG Taojun, ZHANG Jingwen, WANG Lan. Microcircuit Packaging Technology For Beam Encapsulation Diode[J]. PIEZOELECTRICS AND ACOUSTOOPTICS