In order to meet the application requirements of high power density acoustooptic devices, the high melting point metal material is used for preparing the bonding layer. The thermal simulation model of the device is established by ANSYS finite element analysis software, and the thermal design optimization of the device is completed, and an acoustooptic device with high power density is manufactured and verified. The experimental results show that the device has a diffraction efficiency of 81.6% at the operating wavelength of 2 000 nm and the power density is up to 125.0 W/cm2.